Achieving the Ultimate Purity - Written in the Tenth Year of the Company's Establishment

Release time:

2026-06-03

Recently, members of the Qiushiyuan Semiconductor Alliance visited Aishengke and conducted in-depth interviews with the company's founder Zhou Li on topics such as corporate strategy, technology roadmap, and entrepreneurial journey. For the past decade, Aishengke has focused on semiconductor ultra high purity material matching, with the core of "small trial pilot production" full process EPC turnkey capability. It has taken the lead in breaking through the bottleneck of precursor source bottle localization and halved the construction cycle with a modular clean pry solution. With technology, quality and reputation, it has completed more than 300 project deliveries and established "back-to-back" trust with upstream and downstream.

Preface

01 Ultra high purity material panoramic view

Semiconductor ultra-high purity electronic materials run through seven major stages of wafer manufacturing, divided into four categories: wet electronic chemicals responsible for cleaning, etching, developing, and removing adhesives; Electronic vapor serves as the core medium in vapor deposition, etching, and ion implantation; Liquid and solid precursors are used for CVD and ALD film growth, respectively; The photoresist and its supporting developer and stripping solution determine the accuracy of pattern transfer. The purity needs to reach PPT level, and any trace metal or particle may cause short circuits or performance drift. Therefore, materials, equipment, processes, and packaging materials must be synchronized with extreme cleanliness to lay the foundation for chip performance, yield, and reliability.

02 Localization checkpoints and windows

The localization rate of electronic chemicals and specialty gases has been high, while precursors and photoresists are still locked in by Europe, America, Japan, and South Korea; The user (Fab) refuses to easily switch suppliers due to risk and inertia. Domestic manufacturers have the opportunity to break through the development window of advanced processes for storage chips: terminal factories need to localize their supply chains and are willing to provide long verification cycles. Material and equipment companies must jointly complete laboratory small-scale, pilot scale, and mass production amplification, and convince Fab with stable COA data. Whoever passes the verification first will have the advantage in the next round of production expansion, so "speed+reliability" has become the key to substitution.

03 EPC turnkey responsibility for results

Traditional EPC is only responsible for "design procurement construction" and does not guarantee the final purity; Aisengke proposed the concept of "Process EPC", which intervenes from project initiation, providing full process disassembly for reaction, purification, and filling, and taking full responsibility for impurities, yield, and COA during the amplification process. The company has built its own pilot platform to run parameters for customers in advance, and after verification, it directly replicates the production line to avoid the risk of "beautiful laboratory data and mass production failure". The project construction cycle has been halved, helping material factories submit qualified samples to Fab in the shortest possible time and seize the market pace.

04 Hidden threshold for domestication of source bottles

Precursor steel cylinders may appear to be ordinary pressure vessels, but in reality require single-sided welding, double-sided forming, electrochemical polishing, zero metal precipitation, and binding to material factories for remote Fab audits. Aisengke uses photovoltaic MO source bottles to solve color change and residue problems with precision welding and cleaning technology, and then upgrades to semiconductor High-K bottles to provide ready to fill finished products, reducing customer cleaning costs; And synchronously layout channels in South Korea and Taiwan, replacing fixed suppliers in Europe and America with performance, service, and cost in three dimensions, and seizing the incremental market of steel cylinders brought by the localization of precursors.

05 Entrepreneurial Challenges and Alliance Expectations 05 Entrepreneurial Challenges and Alliance Expectations

At the end of the interview, Mr. Zhou mentioned three major challenges encountered in entrepreneurship over the past decade:

1. There is no brand in the initial stage, and long-term free verification and trust exchange are required;

2. Customers use "small workshop" pricing to suppress technical solutions, ignoring research and development costs;

3. Weak intellectual property rights and difficulty in realizing technological value.

After joining the Qiushiyuan Semiconductor Alliance, we hope to use the platform to allow more industry professionals to see and understand Aishengke. We also hope that the alliance can hold more small-scale closed door salons based on its own industry resources to explore cutting-edge industry directions, technology needs, supply chain needs, etc., so that "good products" and "the right people" can quickly meet within a limited window period and share the dividends of the value chain.

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