Case

Electrolytic treatment and precision cleaning of semiconductor equipment
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  • Electrolytic treatment and precision cleaning of semiconductor equipment

Electrolytic treatment and precision cleaning of semiconductor equipment

Mechanical polishing: By precision grinding, the surface flatness of the equipment is improved, laying the foundation for subsequent processing. The highest surface finish of mechanical polishing can reach Ra ≤ 0.05 μ m.

400-928-0585

sales02@js-ask.com

Category

电解产品

Keywords:

Electrolytic treatment and precision cleaning of semiconductor equipment

  • Case Detail

  • Core advantages

    Technological Leadership: Based on Japan's advanced surface treatment technology, ensuring high-precision and high-efficiency processing quality.

    Integrated service: from basic polishing to cleanliness control, covering the entire process of equipment surface treatment needs, reducing the cost of collaboration in multiple links.

    Industry adaptation: Deeply cultivating high cleanliness requirements in fields such as semiconductors, chemicals, pharmaceuticals, LCD panels, etc., targeting solutions to equipment corrosion, particle residue, metal ion precipitation, and other issues.

     

    Process highlights

    1. Mechanical polishing: By precision grinding, the surface flatness of the equipment is improved, laying the foundation for subsequent processing. The highest surface finish of mechanical polishing can reach Ra ≤ 0.05 μ m.

    2. Electrolytic polishing: using electrochemical technology to eliminate micro burrs, improve the ability to suppress metal ion leaching, significantly enhance corrosion resistance and micro flatness.

    3. Passivation treatment: forms a dense oxide film to prevent pollution, ensure product purity, improve corrosion resistance, extend equipment life, create a smooth and inert surface, reduce particles and adhesion, and prevent the occurrence of "red rust" phenomenon.

    4. Precision cleaning: By thoroughly removing various deadly pollutants at the micro and nano scales (particle pollution, metal ion pollution, organic pollutants, natural oxide layers), a perfect substrate is created for subsequent processes to ensure device functionality and improve production efficiency.

     

    Case study before and after electrolytic polishing

    Before electrolytic polishing

    After electrolytic polishing

     

    Product Display

    Product Display

    Product Display

    成品展示

    成品展示

     

     

Electrolytic treatment and precision cleaning of semiconductor equipment

Mechanical polishing: By precision grinding, the surface flatness of the equipment is improved, laying the foundation for subsequent processing. The highest surface finish of mechanical polishing can reach Ra ≤ 0.05 μ m.

400-928-0585

sales02@js-ask.com

Category

电解产品

Keywords:

Electrolytic treatment and precision cleaning of semiconductor equipment